Printed Circuit Boards by Selective Deposition and Processing

Date

2011-08

Advisors

Journal Title

Journal ISSN

ISSN

DOI

Volume Title

Publisher

University of Texas

Type

Conference

Peer reviewed

Yes

Abstract

With electronic applications on the horizon for AM, comes the dilemma of how to consolidate conductors, semi-conductors, and insulators in close proximity. To answer this challenge, laser printing (selective deposition) was used in tandem with fiber laser consolidation (selective processing) to produce PCBs for the first time. This combination offers the potential to generate tracks with high mechanical integrity and excellent electrical conductivity (close to bulk metal) without prolonged exposure of the substrate to elevated temperatures. Herein are the findings of a two-year feasibility study for a “one-stop” solution for producing PCBs (including conductive tracks, dielectric layers, protective resists, and legends).

Description

Keywords

3D Printing, digital fabrication, Additive Manufacturing, printed electronics

Citation

Jones, J. B., Wimpenny, D. I., Chudasama, R. and Gibbons, G. J. (2011) Printed Circuit Boards by Selective Deposition and Processing. 22nd Solid Freeform Fabrication Symposium, 8-10 Aug 2011, Austin, TX, USA. Austin, TX, USA: University of Texas, pp. 639-656.

Rights

Research Institute