Measured thermal images of a Gallium arsenide power mmic with and without RF applied to the input

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dc.contributor.authorOxley, C. H.en
dc.contributor.authorCoaker, B. M.en
dc.contributor.authorPriestley, N.en
dc.date.accessioned2008-11-24T14:02:25Z
dc.date.available2008-11-24T14:02:25Z
dc.date.issued2003-02-01en
dc.description.abstractA gallium arsenide microwave monolithic integrated circuit (MMIC) power amplifier (M/ACom type MAAM71100) has been measured using infra-red microscope technology, with and without the application of a RF input signal. A reduction of approximately 10 °C in chip temperature was observed with the application of a RF input signal, which will influence the MTTF of the chip. Further, the measurement technique may be used to monitor the thermal impedance and dynamic cooling of RF power devices under operational conditions in complex circuits.
dc.identifier.citationOxley, C.H., Coaker, B.M. and Priestly, N. (2003) Measured Thermal Images of a Gallium Arsenide Power mmic with and without RF applied to the input. Solid-State Electronics, 47(4), pp. 755-758.
dc.identifier.doihttps://doi.org/10.1016/S0038-1101(02)00356-8
dc.identifier.issn0038-1101en
dc.identifier.urihttp://hdl.handle.net/2086/296
dc.language.isoenen
dc.publisherElsevieren
dc.researchgroupCentre for Electronic and Communications Engineering
dc.subjectRAE 2008
dc.subjectUoA 24 Electrical and Electronic Engineering
dc.titleMeasured thermal images of a Gallium arsenide power mmic with and without RF applied to the inputen
dc.typeArticleen

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